The PL711 is a compact SPUTTER coating unit based on HiPIMS technology (High Power Impulse Magnetron SPUTTERING). It’s equipped with two Planar HiPIMS cathodes and allows for the deposition of selected nitride as well as carbon-based coatings (DLC2, DLC3) using highly productive processes. Efficient plasma utilization is achieved through an additional booster, the PLATIT 3D module.

The PA3D module (newly developed Helmholtz system) with a central anode focuses a dense, three-dimensional plasma with a high ionization degree in the carousel, generating homogeneous coatings and reaching a high deposition rate. Coatings from the PL711 provide outstandingly smooth surfaces with a high density, hardness and excellent adhesion.

Technologies applied:

  • 2 x Planar SPUTTER cathode
  • HiPIMS technology
  • PA3D module with a central anode focusing a dense and homogeneous three-dimensional plasma with a high ionization degree in the carousel

Etching technologies applied:

  • LGD® (Lateral Glow Discharge)
  • Plasma etching with argon, glow discharge
  • Metal ion etching (Ti, Cr)

Deposition types:

SPUTTER nitride coatings

  • Reactive and non-reactive processes
  • Targets: Ti, Cr
  • Coating temperature at 400°C or <200°C in the low-temperature version

SPUTTER Cr and a-C:H:Si

  • DLC2 (PECVD)
  • Targets: Cr
  • Coating temperature [°C]: 180-220

SPUTTER Cr and ta-C + a-C

  • DLC3
  • Targets: C, Cr
  • Coating temperature [°C]: 180-250

Load and cycle times:

  • Max. coating volume [mm]: 4x ø225 x H800
  • Max. coating height with defined coating thickness: 550mm
  • Max. load: 250kg
  • 2 batches/day

Modular carousel systems:

  • 1 or 3 or 6 axes


  • Simple use and maintenance
  • PLATIT’s SmartSoftware (PC and PLC system)
  • Modern control system with touch screen
  • Data recording and real-time display of process parameters and flow
  • Manual and automatic process control
  • Remote diagnostics and maintenance

Machine dimensions:

  • Footprint [mm]: W3450 x D2250 x H2350


PLATIT PL711 live stream